A slurry-conditioned material is cast into a product-shaped mold and formed by solidification. This is Kyocera's groundbreaking forming technique, which facilitates near-net shapes and is anticipated to broaden the applications of ceramics.
Components crafted through F-Molding exhibit equivalent or superior characteristics compared to those manufactured through Cold Isostatic Pressing (CIP) forming.
Features
-
Creates Unique, Intricately Shaped Parts
Attains intricate designs that are not attainable through traditional green machining and grinding.
Improves cost-effectiveness by curbing material waste and requiring less machining (in comparison to CIP forming)
-
Allows Small-Volume Orders
Initial cost reduction made possible by more economical mold (in comparison to injection molding and press forming)
Design Samples
Image Credit: Kyocera International, Inc.
Manufacturing Process
Image Credit: Kyocera International, Inc.
Image Credit: Kyocera International Inc.
Material Lineup
Source: Kyocera International, Inc.
Material
Material Code |
Zirconia |
Cordierite |
Silicon Nitride |
| ZO206N |
CO220O |
CO720O |
SN240O |
| Color |
- |
White |
Gray |
Gray |
Black |
| Density |
g/cm3 |
6.0 |
2.50 |
2.54 |
3.3 |
Mechanical
Characteristics |
Vickers Hardness
HV9.807N |
GPa |
12.0 |
8.0 |
8.5 |
14.0 |
Flexural Strength
(3-point Bending) |
MPa |
1,100 |
190 |
200 |
1,020 |
| Young’s Modulus |
GPa |
210 |
140 |
145 |
300 |
| Poisson’s Ratio |
- |
0.32 |
0.31 |
0.31 |
0.28 |
| Fracture Toughness (SEPB) |
MPa・m1/2 |
6 |
1-1.5 |
1-1.5 |
7 |
Thermal
Characteristics |
Coefficient of Linear
Thermal Expansion |
40-400 ℃ |
× 10-6/K |
10.4 |
(*) 1.5 |
(*) 1.5 |
2.8 |
| 40-800 ℃ |
10.8 |
(*) 2.1 |
(*) 2.1 |
3.3 |
| Thermal Conductivity |
20 ℃ |
W/ （m・K） |
3 |
4 |
4 |
27 |
| Specific Heat Capacity |
J/ （g・K） |
0.44 |
0.71 |
0.74 |
0.65 |
Thermal Shock Resistance
(quenching into water) |
℃ |
300 |
450 |
400 |
800 |
* <|0.05|(23 ℃)、<|0.02|(22 ℃)
This information has been sourced, reviewed, and adapted from materials provided by Kyocera International, Inc.
For more information on this source, please visit Kyocera International, Inc.