Advancements in Plasma Etching and Deposition Processes for Compound Semiconductor Materials Applications

insights from industryBas DerksemaGlobal Sales and Marketing DirectorOxford Instruments

In this interview, AZoM talks to Bas Derksema about advancements in plasma etching and deposition processes for compound semiconductor materials applications.

Please could you introduce yourself and your role at Oxford Instruments?

My name is Bas Derksema, and I am the Global Sales and Marketing Director for Oxford Instruments. I am responsible for leading global sales and marketing efforts, particularly within the realm of high-volume manufacturing in the compound semiconductor industry.

Could you walk through Oxford Instruments' plasma etching and plasma deposition tools and how customers can integrate them into their workflow?

Plasma technology has consistently provided high-technology equipment tailored to applications essential for the compound semiconductor industry's advancement. Our focus lies primarily on technologies and applications that mainstream silicon-based methods cannot accommodate, particularly those compatible with CMOS production technologies.

With a specialized emphasis on etch and deposition applications, we have honed our strengths to meet the specific requirements of this market. Leveraging our extensive experience, we continue to innovate and deliver solutions to drive progress in the compound semiconductor industry.

I was drawn to this company because of its 40+ years of experience in the field and its esteemed reputation as a leader in the industry. Oxford Instruments possesses extensive expertise in materials such as gallium arsenide (GaAs), indium phosphide (InP), gallium nitride (GaN), and silicon carbide (SiC), which are now emerging as mainstream materials in the industry.

This expertise has been cultivated through early engagement with corporate R&D, academia, and national laboratories, which have made significant investments in advancing these materials. Leveraging this wealth of knowledge and experience, we are well-positioned to capitalize on the current growth trends in the market.

Oxford Instruments' products offer low damage, precision depth, and thickness control during plasma processes. Why is this crucial in ensuring devices have the desired characteristics?

We have several key platforms and applications that we offer, one of which is Atomfab, our production-proven platform for plasma-enhanced atomic layer deposition. A standout feature of Atomfab is its integrated pre-plasma treatment, which prepares the interface for deposition within the same process. This integrated approach has significantly reduced the cost of this step by up to 75%, making it a major game changer in the industry.

With regard to our etching platforms, we provide a specialized atomic layer etching process solution designed specifically for gallium nitride-based devices. This unique process enables etching at the atomic layer level while offering precise control over the etch depth, which can be measured through integrated measurement capabilities. This capability provides a significant advantage by ensuring a damage-free interface before subsequent deposition steps. Moreover, integrating this etch process with atomic layer deposition makes it possible to consolidate both processes onto a single chamber or cluster platform, streamlining production and enhancing efficiency.

Video Credit: Oxford Instruments 

How else do Oxford Instruments' products ensure that customer workflows have a high degree of precision and quality control?

Over my 15 years in the industry, I have seen a trend toward increasingly miniaturized devices with incredibly stringent requirements. Control has emerged as a pivotal aspect of meeting these demands. One notable feature we offer is atomic layer etching with an endpoint detector, a critical component for seamlessly integrating this process into production workflows.

Additionally, our clusterable process and the ability to combine various modules on a single system necessitates a high degree of automation. To address this need, our cluster platforms are equipped with full automation capabilities, enabling cassette-to-cassette production mode for maximum efficiency.

What are some of the target applications and industries for these products? Could you discuss any use cases?

We recently introduced a plasma polishing process tailored for the pre-epi interface preparation of silicon carbide wafers. This dry plasma polishing process offers a more cost-effective alternative to mechanical polishing methods currently in use. Not only does it reduce costs, but it also provides an environmentally friendly option compared to the conventional CMP process, which is a toxic chemicals intensive process.

This innovation has generated significant interest within the industry, and our development project has been met with success. Another noteworthy benefit of this process is its ability to enhance the crystal quality of the interface on silicon carbide wafers prior to epitaxial deposition. This improvement in interface quality is expected to enhance device performance and reliability over the long term.

How does Oxford Instruments continue to offer unique expertise in compound semiconductor material and plasma processing applications? What makes the company stand out?

We are recognized as a trusted partner in the compound semiconductor industry, particularly renowned for our expertise in etch and deposition applications. With our esteemed brand name and the value we bring, we often collaborate closely with customers to develop key processes and applications, enhancing the potential for success.

Our track record speaks for itself, with numerous achievements throughout our history. For instance, we were pioneers in developing the four-inch InP etching process, which has since become the standard on six-inch wafers.

We have dedicated significant efforts to advancing power semiconductor devices for GaN, collaborating closely with academia. One notable partnership is with Professor Kevin Chen, a renowned leader in the field. Through our collaboration, we have successfully developed applications and installed several tools in high-volume manufacturing lines in Asia – those are two key examples of the success that came out of that collaboration.

Additionally, we have made significant strides in the development of microLEDs, pioneering unique etch and deposition processes that have been validated across low-volume to high-volume manufacturing environments.

What is the highest growth market that you feel your solutions are best position to serve?

As previously mentioned, we are recognized leaders in providing etch and deposition solutions for the InP market. One noticeable development in this sector is the increasing demand driven by AI-induced hyperscale data centres. These data centres require devices capable of processing vast amounts of data, and indium phosphide-based lasers and transceivers are ideal for this application.

We have been at the forefront of developing key processes for these applications, giving us a significant advantage in understanding the specific requirements and challenges of this industry. This exemplifies our proactive approach to adapting to emerging trends and anticipating industry demands ahead of time.

Image Credit: Oxford Instruments 

This information has been sourced, reviewed and adapted from materials provided by Oxford Instruments.

For more information on this source, please visit Oxford Instruments.