Sputtering is one of the most common and widely used technologies for thin film manufacturing. FELDCO INTERNATIONAL provides a variety of sputtering target materials in a variety of compositions -PVD- in a different of shapes and thickness per your specifications with purities up to 99.999 %.
Target materials capabilities up to 16" diameter and 20" in length.
Figure 1. Sputtering targets
Aerospace/Defense
Heads-up cockpit displays, Jet turbine blades, Mirrors for optical and x-ray telescopes, Night vision equipment
Architectural Glass
Low-emissivity glass, Energy-producing glass
Automotive
Auto headlight & taillights, Auto trim components, Drive train bearings & components
Data Storage
CDs, Laser disks, Magnetic disks (hard and floppy), Microelectronic flash memory, Read/write heads
Decorative
Appliance trim, Building glass, Building hardware, Clothing, Jewellery, Packaging. Plumbing fixtures, Toys
Displays
CCDs (charge-coupled display devices), CRTs (cathode ray tubes), Flat Panels, Electroluminesent, Photoluminescent, Liquid Crystal Displays (LCD), Plasma Displays, Thin Film Transistor (TFT)
Electronics
Passive thin film components (such as resistors and capacitors), Printed circuit boards, Sensors (for temperature, radiation and chemical composition), Surface Acoustic Wave (SAW) devices
Energy
Efficient signage and outdoor display systems, Gas turbine blade coatings, Turbine bearings, Solar panels
Lighting
Emission filters (for color selection), Energy-efficient commercial lighting, IR intensifiers (for energy efficiency), Traffic signals
Medical
Angioplasty devices, Anti-rejection coatings for implants (e.g. artificial hips, dental implants), Radiation capsules for cancer treatment
Microelectronics
Flip-chip back side metalization (for external electrical contact), Gate dielectric, Interlayer dielectric, On-chip interconnects and interlevel bias
Optics
Anti-reflective/anti-glare coatings for eyeglasses Laser lenses, Optical filters for achromatic lenses (for astronomy and photography), Cable communications (e.g. DWDM), Spectroscopy
Security
Currency, credit-card, and check-security, markings/holograms, Night vision/infrared equipment, One-way security windows
Telecom
EMI/RF shielding (for cellular systems), Fiber-optic coatings, Microelectronic components
Wear Coatings
Anti-corrosion coatings, Anti-seize coatings, Dies and moulds, Printer heads, Sewing needles (for the clothing industry), Tool and drill bit hardening
Sputtering Targets Materials
Table 1. Sputtering target materials
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Boron Nitride
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Titanium Diboride
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Boron Carbide
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Hafnium Carbide
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Silicon Carbide
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Titanium Carbide
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Tungsten Carbide
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Aluminium Nitride
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Silicon Nitride
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Titanium Nitride
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Aluminum Oxide
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Cerium Oxide
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Hafnium Oxide
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Magnesium Oxide
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Calcium Fluoride
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Titanium Oxide
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Zinc Oxide
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Zirconium Oxide
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Yttrium Oxide
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Titanium
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Garnet
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Nickel
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Spinel
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Intermetallics
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Ito
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Pure Metals
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Alloys
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Silicides
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Silicon
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Cerments
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Others PDV Materials
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