Polished Glass Substrates and Wafers

Bullen single- and double-sided polished glass wafers set the standard for quality for your MEMS and optoelectronic applications.

Typical Properties of Bullen Glass Wafers

Bullen glass wafers exhibit:

• Surface finish Ra< 15A and TTV < 9 microns
• Minimal to no sub-surface damage means premium performance for anodic bonding applications and post-polish etching processes
• Superior flatness and parallelism

Bullen Glass Wafer Materials

Bullen can manufacture glass wafers in materials such as:

• Pyrex®
• Schott Borofloat®
• Hoya SD-2
• Fused Silica and
• Quartz

Bullen Glass Wafer Sizes

Sizes of glass wafers range from 2.0”to 8.0”, 50.8 mm to 200 mm, and thicknesses >0.350 mm

Bullen Glass Wafer Edge Finish

Bullen can supply glass wafers with a ground edge with safety bevel.

Cleaning/Packaging

Ultrasonic cleaning in coin-style packaging is standard (slotted wafer containers available upon request).

Glass Wafer Options

Clean room packaging, semi-standard notches and flats available.

This information has been sourced, reviewed and adapted from materials provided by Bullen Ultrasonics Inc.

For more information on this source, please visit Bullen Ultrasonics Inc.