Master Bond offers a number of electrically conductive adhesives filled with silver coated nickel. These compounds provide a more cost-effective alternative to silver filled epoxy systems while providing outstanding electrical conductivity and low volume resistivity.
The superior performance profile of our electrically conductive compounds is widely recognized throughout the electronics industry. The cured products offer high physical strength, superior substrate adhesion and uniform electrical conductivity even upon exposure to hostile environmental conditions. Long-term durability is excellent. Special grades are vibration and shock resistant, cryogenically serviceable, “snap curing”, offer exceptional peel and shear strength and are screen printable. Additionally, NASA low outgassing approved adhesives and a USP Class VI approved system for medical applications is also available.
Basic Properties
Master Bond's silver coated nickel filled electrically conductive adhesive systems are designed to meet specific performance requirements. Specific grades offer a wide variety of properties, among the most important are:
- Chemically resistant
- Cryogenically serviceable
- Excellent adhesion
- Dimensional stability
- High temperature resistance
- Low thermal expansion coefficient
- Reworkable
- Screen printable
- Hardness
- Low outgassing
- Low shrinkage
- Low stress
- Resistance to water
- Peel strength
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- Durability
- Thermal cycling resistant
- Shock resistance
- Impact resistance
- High electrical conductivity
- Thermal conductivity
- Vibration resistance
- Low volume resistivity
- Glass transition temperature
- Compressive strength
- Tensile strength
- Elongation
- Flexural strength
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Major Applications
These products are employed in automotive, medical, appliance, electronic, electrical, microwave, aerospace, and electro-optic industries. Specific applications include:
- Electrical modules
- PCBs
- High frequency shields
- Wave guides
- EMI/RFI shielding
- Entertainment systems
- Specialty heat sinks
- Interconnection repair
- Digital signal processors
- Solar cell manufacturing
- Electrical ground plane interface
- RFID tagging
- Printed wiring board applications
- LED packaging
- Wireless headsets
- Wafer lamination
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- Stack bonding
- Copper/polymide (PI) circuits
- Integrated circuitry
- Flip chip packaging
- Thermistors
- Microprocessors
- Stress control devices
- Wire tacking
- SMD attachment
- Hermetic lid-seal processes
- Communication systems
- Electronic test equipment
- Hybrid microelectronic packaging
- Membrane switches
- Antenna assemblies
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Popular Silver Coated Nickel Filled Products
Some of the popular silver coated nickel filled products are:
EP79
EP79 is a two component, silver coated nickel filled conductive epoxy. Features high peel strength, superior toughness, and low volume resistivity. Serviceable over a wide temperature range of 4°K to +275°F.
EP79FL
EP79FL is a highly flexible, silver coated nickel filled epoxy system. T-peel>20 pli. Low volume resistivity. High bond strength to similar and dissimilar substrates. Resists exposure to thermal cycling.
Master Bond EP79
Master Bond Polymer System EP79 is a novel, cost effective, silver-coated-nickel filled epoxy with exceptionally low electrical resistance. EP79 has a volume resistivity of less than 0.01 ohm-cm at room temperature. It has a convenient 1:1 mix ratio by weight or volume and cures readily at ambient temperatures or more rapidly at elevated temperatures. When cured, it forms strong, tough bonds with high shear and peel strengths. These high strength bonds are resistant to severe thermal cycling, mechanical shock and vibration, as well as many chemicals. This system is suitable for many cryogenic applications with a service temperature range of 4K to 275°F. EP79 is an excellent alternative to silver filled epoxies, and is available in syringes for easy application in addition to standard packaging. Premixed and frozen syringes are also available for use.
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Packaging
Master Bond Inc. offers a wide selection of different packaging solutions to best meet your specific application requirements. They are designed to optimize dispensing of Master Bond compounds. Master Bond's innovative packaging solutions will maximize productivity, reduce waste and maintain consistently high product reliability. Packaging options are available for epoxies, polyurethanes, polysulfides, silicones, acrylics and UV cure systems. Additionally, special packaging is available for anaerobics, cyanoacrylates, latex systems and other resin formulations.
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This information has been sourced, reviewed and adapted from materials provided by Master Bond Inc.
For more information on this source, please visit Master Bond Inc.