The HERCULES integrated lithography track system is based on a modular platform and integrates EVG’s proven optical mask alignment technology with built-in wafer cleaning, baking, resist coating and resist development modules.
The HERCULES system allows cassette-to-cassette processing of different sizes of wafers. It safely handles rectangular, highly bowed, thick, small-diameter wafers and even device trays.
Precision bottom-side and top-side alignment as well as a sub-micron coating to ultra-thick (up to 300 µm) resists can be used for passivation and interlayer applications. The excellent alignment stage design allows highly precise alignment and exposure outcomes at high throughput.
Features
- Multipurpose platform supports completely automated processing of different shapes and sizes of substrates, highly warped mold wafers and even device trays
- Production platform integrates all the benefits of EVG’s precision alignment and resist processing systems in a small footprint
- Coating of up to 52,000 cP helps produce ultra-thick resist features of up to 300 µm in height
- NanoSpray® for coating and protection through structures
- OmniSpray® coating for improved coating of high-topography surfaces
- CoverSpin™ rotating cover ensures low-resist consumption and improved uniformity of resist coating
- Mask handling and storage are fully automated
- Thin, delicate, or warped wafer handling of various wafer sizes with a bridge-tool system
- Optical edge exposure and/or solvent cleaning removes edge beads
- Multi-user concept (infinite number of user recipes and accounts, different user interface languages, and assignable access rights)
- Flexible cassette system and rework sorting wafer management
Technical Data
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| Alignment modes |
Top side alignment: ≤ ±0,5 µm
Bottom side alignment: ≤ ±1,0 µm
IR alignment: ≤ ±2,0 µm / substrate material depending |
Advanced alignment
features |
Manual alignment
Automatic alignment
Dynamic alignment
Alignment offset correction
Automatic cross correction / manual cross correction
Large gap alignment |
Industrial automation
features |
Cassette / SMIF / FOUP / SECS/GEM / thin, bowed, warped, edge wafer handling |
| Exposure source |
Mercury light source / UV LED light source |
| Exposure setup |
Vacuum contact / hard contact / soft contact / proximity mode / flex mode |
| Wedge compensation |
Fully automatic - SW controlled
Contactless |
| Exposure options |
Interval exposure / flood exposure / sector exposure |
| System control |
Operations system: Windows
File sharing and back-up solution / unlimited no. recipes and parameters
Multi-language user GUI & support: CN, DE, FR, IT, JP, KR
Real-time remote access, diagnostics & troubleshooting |
Source: EV Group