ESCATEC, the Electronics Manufacturing Services innovator, has announced its membership of the United Nations Global Compact, the ten principles of which cover human rights, labour standards, the environment and anti-corruption.
Jackets with built-in mobile phones, sports clothes that warn you when your heart rate gets too high, wallpaper with glowing patterns—these are not concepts from a science fiction movie, some of them are actually already available, and they may soon become commonplace. These applications require electrically conductive fibrous materials. Korean researchers have now developed a new process for rendering paper and textile fibers conductive with aluminum. Their report appears in the journal Angewandte Chemie.
Vishay Intertechnology, Inc. today extended its VJ automotive series of surface-mount multilayer ceramic chip capacitors (MLCCs) for high-temperature automotive applications. To save board space, the VJ….31 / VJ….34 now offer a 0402 case size with an X8R dielectric. In addition, the 0603 and 0805 case sizes featuring an X8R dielectric have been enhanced, now offering working voltages of 100 V.
Research and Markets has announced the addition of the "2013 Deep Research Report on Global and China LED Wafer Industry" report to their offering.
eMemory, an embedded non-volatile memory (eNVM) industry leader and United Microelectronics Corporation ("UMC"), a leading global semiconductor foundry, today announced an expanded technology cooperation to integrate eMemory's one-time-programmable (OTP) and multiple-time-programmable (MTP) embedded non-volatile memory technologies into UMC's 28nm process.
The winners of the 5th annual Academic Enterprise Awards have been announced at a conference that brought together Europe's innovation leaders to discuss the importance of research, innovation and entrepreneurship These include 2 EPFL companies out of 10 laureates.
As electronics designers and manufacturers continue to move toward smaller, faster and higher performing devices, the challenge of thermal management is steadily mounting. Less board space and increased operating frequencies are raising temperatures, and risking reduced device performance and reliability over time.
IBM today introduced the fifth generation of semiconductor technology specialized for high performance communications. The company’s latest silicon-germanium (SiGe) chip-making process is designed to enable ever-increasing amounts of data to flow through network backbones in applications such as Wi-Fi, LTE cellular, wireless backhaul and high speed optical communications.
Reportlinker.com announces that a new market research report is available in its catalogue: Research on China Automotive Electronics Industry, 2013-2017
DisplayLink®, the leading provider of USB Graphics technology, today announced the official launch of the DL-4000 family of USB monitor chips and customer products at Computex from industry leaders such as AOC, Asus, and Taeseok. The new DL-4000 family of USB chips enables a new category of ‘green’ monitors capable of providing both power and data over a single USB cable.
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