Veeco Instruments Inc. (Nasdaq: VECO) announced today the introduction of the NEXUS(R) TAMR Physical Vapor Deposition (PVD) System for next-generation Thermal Assisted Magnetic Recording (TAMR), also known as Heat Assist...
Money4Gold Holdings, Inc. (OTCBB:MFGD), a reverse logistics, direct-from-consumer recycler of precious metals and electronics, announces its name change to Upstream Worldwide, Inc. The Company has filed an applicati...
ON Semiconductor Corporation, a premier supplier of high performance, energy efficient silicon solutions for green electronics, today announced it has acquired privately held Sound Design Technologies, Ltd. (SDT) from an affiliate of Global Equity Capital, LLC, in an all cash transaction for initial consideration of approximately $22 million.
Vorbeck Materials Corp., the world’s leading producer of graphene-based materials and manufacturer of the world’s first commercial graphene-based product, Vor-ink conductive inks, announces a new conductive ink formulation for flexographic printing, Vor-ink Flexo.
Resistance to impact, thermal shock, vibration and stress fatigue cracking is of vital importance in the aerospace, optical, medical and oil/chemical processing industries. Master Bond Polymer Adhesive Supreme 10AOHT-LO is a single component, no mix, thermally conductive compound featuring superior electrical insulation and toughness.
Arradiance, Inc. has been awarded a grant under the Department of Energy Small Business Innovation Research (DOE SBIR) program to develop large-area microchannel plates for use as an alternative to traditional photomultipliers.
X-FAB Silicon Foundries, the leading analog/mixed-signal foundry and expert in “More than Moore” technologies, today announced it will expand its foundry service to include 8-inch (200mm) MEMS wafer processing. Moving to the larger wafer diameter and monolithic MEMS/CMOS integration allows significant reductions in manufacturing costs.
Dow Electronic Materials, a leader and innovator in chemical mechanical planarization (CMP) technology for the global semiconductor industry, today announced its Semiconductor Technologies (ST) business was awarded United Microelectronics Corporation’s (UMC) Outstanding Supplier Award for 2009.
The Linde Gases Division’s global electronics business provides reliable, consistent and competitive electronic material products to the global semiconductor and photovoltaic markets.
Extending its reach into the Chinese thin-film display market, Linde LienHwa (LLH), a subsidiary of the technology company The Linde Group, today announced the award of a new gas contract by BOE Display Technology C...
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