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Cargill Dow’s Corn-Based Polymer Approved for Food Contact Applications in Japan

Market research shows that Japanese consumers want more environmentally sound food packaging solutions. With the recent food contact approval for a plastic made from corn, Japanese shoppers will soon be able to purchase ...

22 Jul 2004

20 Micron Thick Wafer Possible with Ultrathin Semiconductor Wafer Backgrinding System from 3M

3M introduces the 3M Wafer Support System for ultrathin semiconductor wafer backgrinding. The new system is an alternative to the conventional tape process for backgrinding and is capable of producing wafers as thin as 2...

21 Jul 2004

Hydro to Upgrade Their Italian Aluminium Rolling Mill

Hydro will upgrade its aluminium rolling mill in Slim, Italy, to meet customer demand for high quality products. The investment will strengthen Hydro Aluminium in Southern Europe and the company’s position as the l...

19 Jul 2004

Expanded Polystyrene Produced Using New Volatile Organic Chemical (VOC) Free Technology

Polystyrene foam is widely used in a variety of applications, including building insulation, packaging and drinking cups. These different types of foam are all commercially produced from a single starting material &ndash...

16 Jul 2004

Graham Packaging Unveils Revolutionary Technology in New PET Bottles

Graham Packaging Company, L.P., a worldwide leader in the design, manufacture, and sale of customized blow-moulded plastic containers, has unveiled a revolutionary new technology that gives customers design freedom and f...

14 Jul 2004

Alcan’s Aluminium Front Bumper Beams Contribute to Opel Astra’s Safety System

Alcan's state-of-the-art aluminium front bumper beams are making an important contribution to the new Opel Astra's safety system. Over a million bumper beams a year are now being manufactured for Opel models alon...

14 Jul 2004

3M Introduce High Performance Diamond Pad Polisher Conditioner for CMP of Semiconductors

3M today introduced an innovative high-performance diamond pad conditioner - the 3M Diamond Pad Conditioner A4-55 - for oxide chemical mechanical planarization (CMP) that upholds 3M's commitment to quality, while off...

13 Jul 2004

3M Introduces New System for Ultrathin Wafer Backgrinding

13 Jul 2004

ISG to Start Second Blast Furnace in Response to Demand for Coated Steel

International Steel Group Inc. today announced plans to increase production at its ISG Weirton Inc. subsidiary in response to strong customer demand for its value-added, coated steel products. ISG will restart a second b...

12 Jul 2004

Tetra Tech Win Contract to Relocate Steel Plant from USA to China

Tetra Tech announced that it has been awarded a $27 million contract from Qingdao Iron and Steel Group Co. Ltd to manage the environmental issues, dismantlement, shipment and reassembly of assets purchased from the bankr...

9 Jul 2004

Editorial Highlights

The Current State of the Global Semiconductor Market

The global semiconductor market has entered an exciting period. Demand for chip technology is both driving the industry as well as hindering it, with current chip shortages predicted to last for some time. Current trends will likely shape the future of the industry, which is set to continue to show

How are Graphene Batteries Made?

The primary distinction between graphene-based batteries and solid-state batteries lies in the composition of either electrode. Although the cathode is commonly changed, carbon allotropes can also be employed in fabricating anodes.

What Role Will The IoT Play In The Electric Vehicle Industry?

In recent years, the IoT is rapidly being introduced into almost all sectors, but it has particular importance in the EV industry.

Packaging News

Cargill Dow’s Corn-Based Polymer Approved for Food Contact Applications in Japan

20 Micron Thick Wafer Possible with Ultrathin Semiconductor Wafer Backgrinding System from 3M

Hydro to Upgrade Their Italian Aluminium Rolling Mill

Expanded Polystyrene Produced Using New Volatile Organic Chemical (VOC) Free Technology

Graham Packaging Unveils Revolutionary Technology in New PET Bottles

Alcan’s Aluminium Front Bumper Beams Contribute to Opel Astra’s Safety System

3M Introduce High Performance Diamond Pad Polisher Conditioner for CMP of Semiconductors

3M Introduces New System for Ultrathin Wafer Backgrinding

ISG to Start Second Blast Furnace in Response to Demand for Coated Steel

Tetra Tech Win Contract to Relocate Steel Plant from USA to China

From Lab to Industry: How Additive Manufacturing is Transforming Structural Integrity

How do CT Instruments Help with Battery Analysis?

How Thermal Analysis Enhances Renewable Energy Systems

CSP Temperature Standards by Thermometrics

Coolant Control Module for Plasma Cleaning

Nano-Observer II: AFM for Nanoscale Imaging

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Tabletop SEM Analysis of Cosmetics

Power Spectral Density: Understanding Surfaces at Different Scales

Complete Guide to 3D Printing

Advanced Imaging Meets AI: Transforming Thermal Barrier Coating Analysis with the Apreo ChemiSEM

Editorial Highlights

The Current State of the Global Semiconductor Market

How are Graphene Batteries Made?

What Role Will The IoT Play In The Electric Vehicle Industry?

Packaging News

From Lab to Industry: How Additive Manufacturing is Transforming Structural Integrity

How do CT Instruments Help with Battery Analysis?

How Thermal Analysis Enhances Renewable Energy Systems

1Accelerating Ion Transport with New Material

2New Catalyst Revolutionizes Hydrogen Peroxide Production

3YASA and Automobili Lamborghini Unveil Next-Generation High-Performance E-Propulsion Technology

4The ECOFAP Project aims to make shoe soles and heels with a new 3D printing material based on tanned leather waste

5New Lithium Composite Promises Enhanced Safety and Lifespan

6Development and Evaluation of P-PPD for Enhanced Crude Oil Flow and Hydrate Mitigation

Sponsored Content

Editorial Highlights