AMI Announce Programme for 3rd International Conference on Thin Wall Packaging

AMI is pleased to announce an exciting programme for the 3rd international conference on Thin Wall Packaging, to be held 28-30th October 2008 at the Maritim Hotel in Cologne, Germany. The meeting kicks off with a top paper from Rainer Schlicht, the Head of Packaging at Campina, followed by market research from Jon Nash at AMI.

Plastics packaging is vital to preserving and protecting scarce food resources. Thin Wall Packaging combines the environmentally friendly aspect of using the minimum amount of material whilst providing the maximum protective and barrier functions. It is used in sectors such as: chilled dairy; catering and disposables; fruit and produce; meat, fish and poultry; frozen food and ice cream; delicatessen; bakery, confectionery and snacks; yellow fats; chilled ready meals and meal components; other ambient foods and non-food packaging.

Many different types of plastics are used in Thin Wall Packaging tubs, cups, containers, trays and jars including polypropylene, polystyrene, PVC and PET. Other polymers are used in lower quantities, such as PLA, polyethylene, ABS, polycarbonate, EVOH and polyamide (SABIC, Mitsubishi Gas Chemical, Milliken, Adeka, LyondellBasell and Ineos Nova). RPC Barrier Containers and Rexam High Barrier Plastic Containers will both be discussing the latest developments.

Manufacturing is constantly improving to cut energy consumption and speed up production. Injection moulding and thermoforming are both widely used and in- mould decoration has been a big feature of the past few years. This year there are expert speakers from the major players on advances in manufacturing (Hekuma, Netstal Maschinen, Illig, Cypet and Husky). There are key sessions on the hot topics of in-mould labelling and high barrier plastics, with Treofan describing the benefits of BOPP film labels and Printing Company Verstraet describing the overall move towards IML.

Sustainability is a big issue for the retail industry and packaging experts have been examining alternative sources of plastics such as biodegradables and recyclate. These have particular benefits and limitations. Biodegradables have sparked a lot of debate in the packaging industry over issues such as availability of polymer, definitions of the term ‘compostable’ and ‘biodegradable’, cost, consumer labelling, etc. This will be discussed at the conference with an expert overview from IK Industrievereinigung Kunststoffverpackungen e.V.. Sharp Interpack will be talking about embracing the environmental opportunity, with Erema on recycling and FKuR Kunststoff on injection moulding biodegradable polymers.

Thin Wall Packaging 2008 offers a meeting point for the industry to debate business trends and improvements in materials and properties. It provides a unique opportunity to network with the wide range of professionals involved with the plastics packaging industry at all levels of the supply chain.

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