Jun 4 2008
DuPont Advanced Packaging Lithography, part of DuPont Electronic Technologies, has fully commercialized DuPont™ WBR 2000 Series dry film photoresist material for advanced semiconductor packaging applications, including electroplated solder, photostencil and copper pillar bumping. These newest DuPont dry film photoresists offer a lower overall cost of ownership, while addressing productivity and environmental challenges.
DuPont™ WBR 2000 Series dry film photoresists are available for advanced semiconductor packaging applications.
"Even the most advanced packaging designs can be produced cost effectively with DuPont™ WBR 2000, and the idea of a dry, solventless process is more appealing from an environmental standpoint," said Mats Ehlin, global business manager for DuPont Advanced Packaging Lithography. "DuPont™ WBR 2000 has unique advantages, which is why it's quickly gaining acceptance as a reliable, well-performing photoresist with a good range of use. DuPont is continuing to innovate with dry films as a superior alternative to liquid photoresists, and we're pleased to see our customers achieve new heights using this film."