SUSS MicroTec, supplier of innovative solutions for the 3D, MEMS, Advanced Packaging and Nanotechnology markets, announced today that it has shipped and successfully installed a Gamma coating cluster at Replisaurus Technologies, a provider of a revolutionary metallization technology called "ElectroChemical Pattern Replication" (ECPR(TM)), which offers a simple and cost effective integrated solution eliminating several traditional process steps thereby reducing complexity. The modular coat/bake/develop cluster from SUSS represents the latest generation technology in high volume production spin coating. Gamma systems are designed to maximize performance at the lowest cost of ownership, while delivering consistently uniform results for a variety of applications such as thin and thick resists, BCB, dielectrics or high topographies.
Replisaurus will use the Gamma for applications related to its proprietary ECPR™ process, a fab-friendly, environmentally-clean metallization process technology, which has extremely fast plating rates. The ECPR™ process combines the precision and resolution of advanced lithography with the ease and efficiency of electrochemical deposition into one single integrated process solution. ECPR™ is targeted at key growth markets such as integrated passives, copper pillars and 3D integration.
"Replisaurus chose SUSS MicroTec to support us with superior coater and developer technology as SUSS is clearly the leader in this market. The SUSS Gamma system meets our high performance requirements by delivering consistently uniform results for a variety of challenging materials, said James Quinn, CEO of Replisaurus Technologies.
“Replisaurus has been devoted to developing production processes for the advanced Packaging and 3D integration market", commented Rolf Wolf, general manager of SUSS MicroTec Lithography Division. “We are excited to support their enabling technology with our Gamma system.”