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3M Settle Wafer Bonding Patent Infringement Litigation

Dec 28 2008

3M and EV Group (EVG) have agreed to settle the patent infringement litigation brought by EVG against 3M in the U.S. District Court for the Southern District of New York relating to systems for temporary wafer bonding.

Under the terms of the settlement, the details of which are confidential, 3M, its customers, and 3M’s licensed suppliers of 3M's Wafer Support System will continue to make, sell and use the Wafer Support System in global semiconductor and packaging markets. EVG will continue to defend its patent portfolio and protect its intellectual property.

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