Meldin 7001 Polyamide Replaces Vespel in Semiconductor Applications

Meldin 7001 polyimide from Professional Plastics is replacing Vespel SP-1 in an expanding number of semiconductor applications including Wafer Processing, Handling and IC Testing components. Meldin provides a combination of high-performance properties and superior economical performance.

Meldin® 7000 Series Polyimide Shapes are available in standard 37" lengths (940mm) and 12" x 12" plates (305mm x 305mm). 44% Larger plates provide superior yields when compared to smaller Vespel® Plates.

Meldin 7001 is ideal for electrical and thermal insulating applications. In Semiconductor Wafer Processing applications, the plasma etch rate of Meldin 7001 is lower than Vespel SP-1 providing superior performance over time. In IC Test Sockets & Probe Test Heads, Meldin 7001 has replaced more expensive Vespel SP-1 while meeting the same performance standards for precision micro-drilling and long-term stability.

Meldin 7001 products feature operational temperatures of 500ºF (260ºF) for continuous operation and 900ºF for intermittent exposure, and tight tolerances of ±0.001 in. on both ODs and IDs. Meldin 7001 is suitable for high-temperature structural, high-purity semiconductor components.

Tell Us What You Think

Do you have a review, update or anything you would like to add to this news story?

Leave your feedback
Your comment type
Submit

While we only use edited and approved content for Azthena answers, it may on occasions provide incorrect responses. Please confirm any data provided with the related suppliers or authors. We do not provide medical advice, if you search for medical information you must always consult a medical professional before acting on any information provided.

Your questions, but not your email details will be shared with OpenAI and retained for 30 days in accordance with their privacy principles.

Please do not ask questions that use sensitive or confidential information.

Read the full Terms & Conditions.