The technology group, The Linde Group, and leading Chinese engineering university, Shanghai University, announce today their partnership to explore and develop new advanced packaging solutions for flexible displays to enhance product quality and cost efficiencies.
The joint research and development (R&D) project will take place at the university's research centre, the Key Laboratory for Advanced Display and System Applications, to explore new gas application techniques for the manufacturing and packaging of flexible display technology. Linde has invested an initial RMB 800,000 (EUR 80,000) for phase one of this joint project.
Linde and Shanghai University aim to develop a new generation of thin-film encapsulation material and packaging solutions for the manufacturing of electronic display technology, especially for flexible organic light emitting devices (OLEDs). In this partnership, Linde and Shanghai University will work together to develop single and composite structures of thin-film encapsulation materials and related gas application techniques, and study the interaction of display devices and different packaging design structures.
Traditional packaging materials and methods have been limiting the development of organic light-emitting display in terms of lighting efficiency, packaging profile and size, design flexibility and fabrication cost.
Linde and Shanghai University's research results is set to bring significant process, design flexibility and cost benefits to the industry and consumer market with the potential of developing more advanced and compact product designs that integrates display technology. The demand for more flexible LED designs is growing in tandem with the constant evolution of new cutting-edge consumer products and technologies. Studies have shown that OLED has entered a phase of rapid development, and its worldwide shipment forecast will increase to 227 million chips in 2012 from 76 million in 2007.
"At Linde, one of our corporate values is about 'Innovating for Customers'. We live up to this commitment through our Linde research and development centres all over the world where we develop gas-related solutions for our customers and by partnering leading research institutes akin to Shanghai University for the development of new solutions for industry needs," said Christoph Laumen, Head of Global Application Development of Electronic Packaging, The Linde Group, "Our application technology expertise, including equipment, process know-hows and gases engineering expertise, is our value added contribution to the growth markets, with emphasis on innovating new solutions for sustainable development of the future."
Linde's funding covers the cost of experimental materials, gases, facilities and analysis testing for research purposes. Linde's engineers from its Shanghai-based research and development centre, the Linde Technology Centre, will also be involved in the project full time. A review on the R&D project findings will be conducted end 2010 to dictate the direction of the project in its next subsequent phase.
"Shanghai University's research centre is the key laboratory supported by the Chinese Education Ministry, with strong endorsement from Shanghai municipality. We have a wealth of research experience and maintained broad industry communications in OLED and TFT liquid crystal display. With The Linde Group, we are confident that we will achieve breakthroughs in thin-film processing technology in the OLED and flexible organic display packaging. In addition, developing technical solutions using innovative gas application will serve flexible organic display manufacturing with enhanced quality, prolonged work life and reduced cost of high volume production," said Professor Jianhua Zhang, Head of the New Display Laboratory and Semi-conductor Optotronics.
Linde's partnership with Shanghai University is one of several research and development programmes in the electronics industry. Linde has as well on-going programmes with Fraunhofer Institutes, Tsinghua University and Hong Kong Polytechnic University, involving chip packaging, printed circuit board fabrication and assembly industries.