Nov 11 2010
Kulicke & Soffa Industries, Inc. (Nasdaq: KLIC) (“K&S”) introduces the IConnPS ProCu, the world’s leading wire bonder optimized for copper wire bonding.
This is the latest addition to the highly successful Power Series product line, which offers high accuracy over a large bondable area.
A result of years of fundamental research and development into the properties and bondability of copper wire, the IConnPS ProCu offers a significant and new level of capability for customers transitioning from gold to copper wire bonding. It employs a combination of precisely designed new hardware, an optimized gas delivery system, and powerful new process controls to provide the most advanced system available for copper wire bonding. The key features include:
- Specialized copper processes, ProCuBond and ProCuSSB, that successfully address the many challenges of bonding copper wire while delivering higher productivity
- New process tools and features that make the complex capabilities easy to use
- A new cover gas delivery system enabling the widest process window with less gas consumption
- High precision gas regulation, metering, and filtering for production stability
Bruno Guilmart, President and CEO of K&S, said “the IConnPS ProCu is uniquely designed to accelerate the industry transition to copper wire bonding from expensive gold wire. K&S is the technology and market leader in wire bonding, and the IConnPS ProCu extends our leadership position in copper.”
In addition to wire bonders, K&S has been delivering innovative capillary solutions for fine copper wire bonding. The latest offering is the CuPRA3G(TM) which delivers excellent bondability, extended life span, and superior workability with any copper wire type.
The IConnPS ProCu is currently being qualified with customers. Initial production shipments to customers are anticipated this quarter.