Heat Sink Compounds to be Used as Thermal Coupler in Heat Sink Devices

Engineered materials distributor, Krayden launches the 340 heat sink compound developed by Dow Corning.

Key features of the compound are high thermal conductivity, high temperature stability and low bleed benefits. The applications of the 340 heat sink compound are LEDs, silicon-controlled rectifiers, aircraft engines, diodes and transistors’ mounting studs. In addition, the compound is used as a thermal coupler in heat sink devices.

The heat sink compound contains a silicone-based fluid. A metal oxide filler that conducts heat is used to thicken this grease-like fluid. This provides high thermal conductivity to the 340 compound. Dow Corning’s silicone-based compound is resistant to consistent temperature changes up to 350°F giving rise to a positive seal of the heat sink. This helps to enhance heat transfer from an electronic device, thereby enabling the compound to offer increased efficiency. The DC 340 behaves as a thermal coupler for heat sink devices and is constant at elevated temperatures.

As an authorized distributor of Dow Corning’s products, Krayden offers the 340 silicone-based compounds in multiple packages ranging from small tubes to drums. Small tubes are distributed for individual use and drums for production lines and large scale operations.

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