Air Products, a comprehensive solutions provider to the worldwide electronics packaging, assembly and test industry, will unveil an advanced wave soldering technology called Inert Wave Soldering for the electronics packaging and assembly industry at the 2011 IPC APEX Expo to be held from 12 to 14 April 2011 in Las Vegas, Nevada.
The Inert Wave Soldering technology is Air Products’ proprietary technology that uses current or new soldering equipment. It tackles the major problems encountered by the electronics packaging and assembly market by offering enhanced nitrogen inerting in wave soldering uses.
By effectively utilizing nitrogen, the Inert Wave Soldering technology helps customers to decrease material and production expenditures that include reduction of flow rates of nitrogen. It facilitates the conversion to lead-free soldering technology and improves the quality of soldering joints considerably. At present, over 50 devices with Air Products’ patented technology are deployed at major electronics assembly firms across the world.
Air Products’ leading researcher, Christine Dong, will give a presentation about the company’s sophisticated nitrogen inerting technology at the expo in April 12, 2011. In the presentation, Dong will speak about the technology’s production trial data, laboratory assessments and technical information.
The global Manager of Electronics Packaging, Assembly and Test at Air Products, Greg Arslanian, stated that the company has included more features in its current system, which solve major problems of using nitrogen inerting in wave soldering. The next-generation technology has decreased dross formation and major faults in everyday production, Arslanian said.