RJR Polymers, a company specializing in high-efficient air cavity packages (ACPs), declared that it will display its novel liquid crystal polymer semiconductor packaging technology at the International Microwave Symposium to be conducted from 5 to 10 June, 2011 in Baltimore, Maryland.
RJR Polymers’ latest liquid crystal polymer technology provides an economical, highly efficient replacement solution to ceramic ACPs for microwave and radiofrequency system developers. It also offers superior design versatility and thermal management functionalities.
Power RFs
The liquid crystal polymer semiconductor packaging technology features an innovative three-piece package design that withstands parts having mismatched coefficients of expansion and allows the utilization of superior thermal conductivity materials. Producers who use the technology can select an extensive range of possible substrate materials such as diamond, copper and alloys.
RJR Polymers also provides package assembly devices and pre-applied epoxy-coated lids. The liquid crystal polymer packaging technology enables manufacturers to endorse a broader range of frequencies and power levels, while sustaining the moisture resistance and mechanical stability equal to that of ceramic packaging.
The packaging technology expands the design options available to OEMs. It employs a regular molding method and has a seal surface with a dielectric constant equal to one-third of copper and ceramic leads. OEMs can economically produce numerous portfolios of products with minimum market-reach time by merely exchanging the lead frame and forming a single injection mold.
RJR Polymers’ existing products include metal-based, thermally improved ACPs for QFN and radiofrequency power applications.