4Wave, a provider of ion beam thin film equipment and coatings, has announced the receipt of numerous orders from failure analysis labs and semiconductor manufacturers for the company’s ion beam de-layering system in the second quarter of 2011.
The company’s de-layering system has the capability to atomically remove material in semiconductor dies. The technology can be applied in micro-electronic devices that have widths of less than 48 nm. In a multilayer micro-electronic structure, the user would be able to choose where exactly the removal of the material has to be stopped for reverse engineering or failure analysis.
Existing techniques used for deconstructing semiconductor dies have become impractical due to the shrinkage in line widths of micro-electronic devices, which could continue to decrease to less than 28 nm. 4Wave’s ion beam de-layering technology has the capability to remove a complete die layer to expose the circuit lying below in any sort of material composition.
The company provides a comprehensive set of thin film metrology and processing equipment for contracted research and coating services. 4Wave is compliant with International Trade and Arms Regulation, which allows it to support projects related to the U.S. defense. 4Wave provides equipment for various applications and industries, such as renewable energy and defense.
4Wave's business model of continued investment in development, and capability to deliver effective systems allows its customers to cut down their product development cycle.