Nordson DAGE has announced that it will be exhibiting its bondtester and digital X-ray inspection systems at the SEMICON West 2012 conference and exhibition to be held in San Francisco, California from July 10 to 12 this year.
Nordson DAGE 4000Plus Bondtester
Nordson DAGE will showcase its XD7600NT Diamond X-ray Inspection System, which features a sealed transmissive, maintenance-free X-ray tube. It has a 2 MP XiDAT3 digital image detector; the X-ray tube provides 0.1 µm feature recognition with power of 10 W, which makes it suitable for high magnification imaging tasks. The device can be controlled by a ‘point and click’ operation through the image wizard software provided by the company. It does not use joysticks for operation. The XD7600NT has a vertical system configuration and the X-ray tube is located below the detector’s isocentric ‘move and tilt’. The software enables collision-free and safe inspection that is needed for production applications.
The Nordson DAGE 4000Plus Bondtester will also be showcased at the event. The device demonstrates high repeatability and data accuracy in bond testing. The tester utilizes advanced Paragon software that provides better data reporting, automatic GR&R calculation, semi-automatic test routines and an exclusive database search engine wizard. The requirements of new test applications such as bend testing, fatigue testing, pad cratering using hot pin pull, and ribbon pull are met by the Nordson DAGE bond test technology.
The company will be exhibiting in Booth #5971 North, at the Moscone Center in San Francisco.