Jan 28 2013
Founder PCB, the largest Chinese owned fabricator of advanced printed circuit boards has announced it will showcase an array of new and innovative technologies for supporting high speed data transmission at this year's DesignCon 2013 to be held at the Santa Clara Convention Center, January 29th and 30th.
Founder PCB SVP and CTO/CMO George Dudnikov commented, "This is our third year of exhibiting at DesignCon. It has been a great venue for us to engage with US customers looking for a lower cost supplier of advanced high speed PCBs."
Visitors to the Founder PCB booth will be able to view the following technologies and data:
- Insertion Loss comparison of some of the newest laminate materials from US and Asia laminators
- PCB process variability effects on high speed Signal Integrity
- Large form factor backplanes running over 25Gbps serial transmission
- Backdrilling of 1mm and .8mm BGA vias with 2 track routing
- SpL-50 ( 50 micron) and SpL-40 ( 40 micron) power/ground core laminates for spreading inductance on PDNs
- FVS via structuring technology for splitting through holes without sequential lamination
- Active and Blind Press Fit backplanes
Added Dudnikov, "Founder PCB is one of the few companies in the industry that operates a dedicated R&D Institute comprised of 16 researchers who focus on developing and testing leading edge PCB technologies. This group collaborates with customer designers and engineers on developing their next generation products and platforms. This year we will have technical people in our booth who will showcase some of the new technologies we have been working on."
Visit Founder PCB Booth 323 at DesignCon 2013