Jan 30 2014
Indium Corporation announces a new solder paste technology. BiAgX™ is a high-melting lead-free (Pb-free) solder paste technology designed for high reliability electronics assembly applications.
Designed as a drop-in replacement for standard high Pb-containing solder pastes, it has passed MSL1 and thermal cycle testing at several power semiconductor customers.
BiAgX™ is excellent for small, low-voltage QFN packages that are used in portable electronics (smartphone/tablet), automotive electronics, and industrial applications. It excels in high temperature environments in excess of 150°C. It requires minimal process adjustments and no capital expenditures for customers converting from a standard high Pb-containing solder paste-based process.
BiAgX™ addresses both customer demands and potential legislative changes that eliminate lead from high-melting die-attach applications. It is both Pb-free and Sb-free (lead and antimony) and does not contain costly specialty materials, such as nanosilver or sintering aids.
BiAgX™ is a high-melting lead-free (Pb-free) solder paste technology.
BiAgX™ reflows, solders, wets, and solidifies just like any other solder paste, and is available in both dispense and printing forms. Fluxes are cleanable with standard cleaning chemistries and processes.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, solar, thin-film and thermal management markets. Products include solders, preforms, and fluxes; brazes; sputtering targets; indium, gallium, and germanium metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA.