SHENMAO Technology, Inc. today announced plans to exhibit in Booth A21 at NEPCON Vietnam, scheduled to take place Oct. 11-13, 2018 at the Saigon Exhibition and Convention Center in Ho Chi Minh, Vietnam. SHENMAO will introduce the PF606-P245 solder paste PF606-F13 as well as the PF604-JF3 solder wires.
PF606-P245 solder paste has solved head-on-pillow issues and improved ICT testability. With the wide reflow window, PF606-P245 can fit easily into the process of most complicated PCB design.
PF606-F13 is a lead-free and halogen-free solder wire designed for automatic soldering machines. It offers excellent solder joint reliability and joint strength.
PF604-JF3 is suitable for high-temperature flame type soldering, which is used in the bending process of copper tubes for air conditioners.
NEPCON Vietnam 2018 is the 11th edition of Vietnam’s only exhibition on SMT, testing technologies, equipment and supporting industries for electronics manufacturing. It is the region’s premier gathering of the industry for connecting people, products, technologies and solutions across the global electronics manufacturing supply chain.
Visit SHENMAO in Booth A21 to speak with the company’s technical experts.