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SHENMAO to Exhibit Low-Temperature Solder Pastes at ECTC

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SHENMAO America, Inc. is pleased to announce that it will exhibit at the 2019 IEEE Electronic Components and Technology Conference (ECTC), scheduled to take place May 28-31, 2019 at The Cosmopolitan of Las Vegas. The company will showcase its PQ10 series low temperature solder paste in Booth #500.

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PQ10 series low temperature solder paste is made with the modified Sn/Bi alloy with lower melting point range from 137~142 °C to 137~170 °C. In comparison with SnAgCu, PQ10 offers reduced peak reflow temperature, energy consumption, and warpage of PCBs and components. In comparison with the Sn42/Bi58 Eutectic alloy, PQ10 series offers better ductility, finer microstructure, and increased drop and thermal reliability.

SHENMAO has successfully been approved by many international well-known electronic manufacturers. The company strives to offer the best quality without compromising cost and time-to-market while providing maximum value to all customers. SHENMAO America, Inc. blends SMT solder paste at its facility in San Jose, CA for distribution in North America.

Source:

http://www.shenmao.com

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