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Indium Corporation Features Metal Thermal Interface Materials for Burn-In and Test at TestConX

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Indium Corporation will feature its metal thermal interface materials (TIMs) for burn-in and test at TestConX, March 1-4 in Mesa, Arizona, USA.

 

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Indium Corporation’s wide portfolio of metal-based TIMs offers proven solutions for a wide variety of applications and process challenges:

 

  • Challenge: thermal conductivity. Heat dissipation is key to maintaining the longevity and reliability of devices. A pure indium Heat-Spring® offers uniform thermal resistance with minimized surface resistance and increased heat flow.
  • Challenge: handling and multiple insertions. HSMF-OS is a compressible TIM with adhesive properties on just one side for easy hand placement. Its high tensile strength (approximately 90 MPA) with a soft, compliant polymer backing provides a configuration with “designed in” insertion survivability.
  • Challenge: pump-out. Because Indium Corporation’s products are made of metal, they won’t pump-out, even under power cycling.

 

To learn more about Indium Corporation’s metal thermal interface materials for burn-in and test, visit www.indium.com/TIMs.

 

Source:

www.indium.com

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