ClassOne Equipment Selected to Represent High-Performance Takano Particle Inspection Systems

ClassOne Equipment, the industry’s leading provider of refurbished semiconductor equipment will now also be representing a line of brand-new, high-performance bare wafer particle inspection systems from the Japanese manufacturer Takano. ClassOne Equipment now becomes Takano’s exclusive representative for North America, Europe, and Israel. The announcement was made by ClassOne’s CEO, Byron Exarcos, and Takano of America’s General Manager, Roy Izai.

“We selected ClassOne Equipment because of their strong reputation and extensive metrology customer base across North America and Europe,” said Izai. “They have years of experience in the category and a solid support infrastructure. Our particle inspection systems have already proved extremely successful in our Japanese and Asian markets, with hundreds of tools already installed. Now, ClassOne will be bringing these high-performance products to fabs all across North America and Europe.”

"It's a very good fit," said Exarcos. "We’re delighted to be partnering with Takano because they’re known for building very high-quality, high-reliability products. They've long been respected, especially in the Japanese and Asian markets. And in this case, they’re filling a critical need in the semiconductor industry. Specifically, they are replacing legacy inspection equipment and technology that’s over 20 years old – and they’re delivering new state-of-the-art tools with leading-edge performance.”

“Another important advantage in these Takano systems is their attractive pricing,” said Exarcos. “It means that now ClassOne can offer customers a brand-new particle inspection system, with current software and hardware and industry-leading sensitivity, plus guaranteed reliability and ongoing support, all at a price that’s only marginally higher than refurbished alternatives.”

ClassOne Equipment will be offering two new Takano particle inspection systems for unpatterned silicon wafers: One is for wafers up to 200 mm; the other is for wafers up to 300 mm.

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