Master Bond EP5TC-80 is a one part, NASA low outgassing rated epoxy that achieves a thermal conductivity of 3.3-3.7 W/(m·K), while also retaining its electrical non-conductivity. It requires a cure at only 80 °C for 1.5 to 2 hours. To optimize performance properties a post cure of 1-2 hours at 80 °C is recommended. Featuring a thixotropic paste consistency, this compound adheres well to a variety of substrates such as metals, composites, glass, ceramics, and many plastics. It is formulated for bonding, sealing and small encapsulating applications.
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EP5TC-80 is electrically insulating, with a volume resistivity greater than 1014 ohm-cm. It features a low thermal resistance of 6-10 x 10-6 K·m2/W and can be applied in very thin sections due to its ultra-fine particle filler. This high strength system has a tensile modulus exceeding 1.5 million psi, and a compressive strength ranging between 25,000 and 27,000 psi.
EP5TC-80 exhibits good dimensional stability with a low shrinkage upon cure, a Shore D hardness of 90-100, and an elongation of 0.5 to 1.5%. It is serviceable over the temperature range of -50 °C to +150 °C and has a glass transition temperature of 110-115 °C. Packaging is available in 3 cc, 5 cc, 10 cc and 30 cc syringes and ships in dry ice.
Master Bond Thermally Conductive Epoxy Systems
Master Bond EP5TC-80 is a thermally conductive, electrically insulating, one part epoxy system for bonding, sealing and small encapsulating applications. It meets NASA low outgassing requirements. Read more about Master Bond’s thermally conductive adhesives at: https://www.masterbond.com/properties/thermally-conductive-epoxy-adhesives