Sponsored by HORIBAAug 14 2007
HORIBA - Thin Film Division provides advanced thin film metrology, processing and plasma diagnostic instruments for research, industrial and quality control applications.
Our core technologies include:
- Ellipsometry
- Reflectometry
- Optical Emission Spectroscopy
- Polarimetry
either as single techniques or in combination for powerful customized solutions.
Thin Film Metrology Solutions
Spectroscopic Ellipsometers
Spectroscopic ellipsometer allows the accurate characterization of a range of properties including the layer thickness, optical constants, composition, crystallinity, anisotropy, and uniformity. Thickness determinations ranging from a few angstroms to tens of microns are possible for single layers and complex multilayer stacks.
In-Situ Ellipsometers
In situ spectroscopic and laser ellipsometer allows the real-time monitoring and control of thin film deposition and etch processes with sub-monolayer resolution. In situ spectroscopic and laser ellipsometers provides real-time calculation of film thickness, optical constants, composition of thin film stacks in different ambient.
Fully Automated Ellipsometers
Automatic Spectroscopic and laser ellipsometer such as the UT-300 and PQ Ruby provide production line monitoring of film thickness measurements, optical constants and film composition. Advanced automation, standardization and robust data are delivered to suit the advanced requirements of semiconductor industry for volume production.
Large Area Metrology Platform
Flat panel metrology systems integrate a spectroscopic ellipsometer and DUV spectroscopic reflectometer. They allow the accurate and fast characterization of film thickness, optical constants and reflectivity of patterned as small as 10 microns and multilayer materials.
In Situ Process Control
- Optical Emission Spectroscopy
- Ellipsometry
This information has been sourced, reviewed and adapted from materials provided by HORIBA.
For more information on this source, please visit HORIBA.