The EP21TDCSMed is a two component, room temperature curing toughened epoxy adhesive featuring exceptionally low volume resistivity. This silver filled compound has a convenient non-critical one to one mix ratio by weight and can be applied on vertical surfaces with minimal sagging. It is resistant to thermal cycling and has exceptional bond strength to both similar and dissimilar substrates. EP21TDCSMed is USP Class VI approved and is widely used in medical electronic applications that require biocompatibility.
Key Features
- Volume resistivity, 75 °F: <10-3 ohm-cm
- Thermal conductivity, 75 °F: 24-26 BTU•in/ft2 •hr•°F [3.46-3.75 W/(m•K)]
- Tensile strength, 75 °F: 3,000-4,000 psi
- Tensile modulus, 75 °F: 250,000-300,000 psi
- USP Class VI certified
