The observation of dynamic response is crucial for testing and designing MEMS devices. This is essential for verifying FE calculations and establishing cross-talk effects.
The patented and novel MSA-650 IRIS Micro System Analyzer helps measure real MEMS dynamics by defining both out-of-plane and in-plane movement via silicon encapsulation without making any contact and without having to prepare or decap the device.
During fabrication processes, the MEMS capping step may lead to more stress, which may change the performance of the device. Hence, a complete characterization of the MEMS device in its encapsulated and final condition is required and crucial.
Highlights
- High-resolution modal data of up to 25 MHz
- Extracting live movement data even from complex-structured Si-capped MEMS
- Excellent separation of distinct device layers in capped MEMS provides the real dynamical behavior of MEMS devices
- Simplified FE model verification of MEMS in the final state
- Video microscope measuring mode shows the in-plane movement up to 2.5 MHz
- Built-in high-performance IR microscope helps measure through silicon walls
- Regular data export formats for modal data, and video and graphics for direct post-processing
Modal Testing of Silicon Encapsulated MEMS
Laser-Doppler Vibrometry (LDV) is a proven method to analyze the mechanical dynamics of MEMS with excellent accuracy. But a majority of the laser vibrometers operate at visible wavelengths for which the encapsulation of silicon is opaque and prevents the inspection of MEMS devices. Hence, LDV testing of these MEMS through visible wavelengths needs either un-encapsulated MEMS or decapping the device.
MSA-650 IRIS patented infrared laser technology visualizing dynamics of capped MEMS. Image Credit: Polytec
MSA-650 IRIS Micro System Analyzer workstation measuring MEMS dynamics through Si-encapsulation. Image Credit: Polytec
Polytec MSA-650 IRIS integrated into a MPI probe station. Image Credit: Polytec
The MSA-650 IRIS, with a low-coherence SLD source and a specialized IR camera, is the world’s first measurement system equipped with this technology to quantify in-plane vibration on encapsulated silicon MEMS with as low as 30-nm resolution and live out-of-plane vibrations of up to 25 MHz with picometer resolution and below.
The latest interferometer technology from Polytec provides superior data quality, thanks to the excellent separation of individual device layers in capped MEMS devices.
Related Areas of Applications
- Solar, semiconductors and electronics
- Nanotechnology and microtechnology
- Medicine and biology
Accessories and Components
Tripods, Test Stands, and Positioning Stages
A-STD-TST-01 Test Stand
This test stand provides sufficient workspace. With a motorized Z-axis, the travel range is 200 mm.
Image Credit: Polytec
A-STD-BAS-02 Base Stand
This stand provides rigid support for the sensor head. It includes a manual focus block with a travel range of 100 mm along with a fine and coarse drive. The stand interfaces to optical tables available in the market.
Image Credit: Polytec
A-STD-F50 Focus Block
The focus block has a travel range of 50 mm with a fine and coarse drive for manual Z-axis adjustment of the sensor head. It interfaces with wafer probe stations available in the market.
Image Credit: Polytec
Vibration Isolation, Breadboards
A-TAB-AIR-01 Active Vibration Isolation Table
This air-damped vibration isolation table comes with an active-level adjustment. It is compatible with A-STD-BAS-02 Base Stand and A-STD-TST-01 Test Stand.
Image Credit: Polytec
A-TAB-ELC-01 Active Vibration Isolation Table
This table provides an electronically regulated voice coil stabilization for maximum isolation performance. It is compatible with A-STD-BAS-02 Base Stand and A-STD-TST-01 Test Stand.
Image Credit: Polytec
A-BBO-ME02 Breadboard
This breadboard comes with a metric hole pattern. It measures 900 x 600 mm and is compatible with A-STD-BAS-02 Base Stand.
Image Credit: Polytec
A-AVI-MELA Active Vibration Isolation Breadboard
This breadboard is electronically controlled for the maximum performance of vibration isolation. Featuring a metric hole pattern, the breadboard measures 600 x 800 mm and is compatible with A-STD-BAS-02 Base Stand.
Image Credit: Polytec
Miscellaneous
MSA-A-WPM Wafer Prober Module
The wafer prober module, along with the A-PST-200P XY positioning stage, creates a motorized platform for electrical contacting and highly accurate measurement of substrates and wafers up to 200 mm in diameter.
Image Credit: Polytec