A discovery reported in the August 5 issue of Science could speed the design of materials that approach the hardness of diamond yet remain supple enough to be worked like metal.
In a massive computer simulation invol...
For about 40 years, the semiconductor industry has been able to continually shrink the electronic components on silicon chips, packing ever more performance into computers. Now, fundamental physical limits to current tec...
Dresden based BIOP Biopolymer Technologies AG expands its production capacities. The chemical company will build a new plant in Schwarzheide (Brandenburg, Germany). “Approximately seven million Euros will be invest...
The catalytic reforming of liquid fuels offers an attractive solution to supplying hydrogen to fuel cells while avoiding the safety and storage issues related to gaseous hydrogen. Existing catalytic support structures, h...
Veeco Instruments Inc. announced today that it has been awarded the R&D 100 Award for a new technique enabling high-resolution, interferometric measurement through glass and other transparent media. Research and Deve...
Scientists at The University of Manchester have discovered a new class of materials which have previously only existed in science fiction films and books.
A team of British and Russian scientists led by Professor Geim...
PSI-TEC Corporation has announced that celebrated polymeric electro-optic expert, Dr. C.C. Teng, will join the scientific staff of PSI-TEC. Dr. Teng has elected to join the company in the current and future evaluation, o...
Researchers from Korea, Italy, France and the ESRF have just observed how a molecule changes structure after being hit with a short flash of laser light. Thanks to very intense pulses of X-rays from the synchrotron and n...
For makers of computers, disk drives and other sophisticated technologies, a guiding principle is the smoother the surfaces of chips and other components, the better these devices and the products, themselves, will funct...
In the last few years, semiconductor circuit features have shrunk to sub-100 nanometer (nm) dimensions, while the size of the thin silicon wafers that these circuits are constructed on has grown from 200 millimeters (mm)...
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