Semiconductor technology-based solutions provider for visualization, sensor and lighting applications, OSRAM Opto Semiconductors has proclaimed that it will convert and expand its two chip production plants into 6" wafer production plants.
InGaN chips
In Penang, Malaysia, OSRAM is currently constructing a new manufacturing facility, while in Regensburg, Germany, it is reallocating the existing space. The two plants will shift from existing 4" wafers to 6" wafers production by accommodating the new production technology. These efforts are anticipated to increase the chip manufacturing capacity to nearly two folds for white LEDs by 2012 end.
The Penang chip production facility, which entered into operation two years ago, has been prepared for expansion and conversion to 6" wafers. The total production area will be increased to nearly 25,000 m2 in 2012. At the Regensburg facility, production of indium gallium nitride (InGaN) will be shifted gradually by 2011 summer.
The Chief Executive Officer of OSRAM Opto Semiconductors, Aldo Kamper stated that the company is constantly strengthening its market footprint by expanding the production capacity of InGaN chips. The capacity increase will mainly impact InGaN chips using UX 3 and thin-film technology, which are needed in the white LED production.