Valtech announced that it will exhibit an entire range of formulated cleaning detergents, custom molded polymers and high-performance epoxy adhesives used in photovoltaic applications at Intersolar North America.
Slicing beams, which are made using custom molded polymers, are utilized to mount silicon ingots for wafer processing. The beams provide a number of benefits such as decreased adhesive usage and processing time, consistent adhesive thickness and easy removal of silicon wafers. They prevent the need for intermediary glass and aluminum plates and reduce the total cost in silicon wafering.
Valtech’s formulated detergents are used to clean sliced silicon wafers in in-line and mechanical ultrasonic processes. The detergents, made with pure raw materials, are available in regular foam, low foam and in variety of other formulations. The detergents do not leave any organic or inorganic deposits after the rinsing process.
The performance of two-component epoxy adhesives surpasses the requirements in semiconductor and photovoltaic wafer production utilizing both wire saw slicing and annular slicing techniques. The adhesives enhance productivity, reduce wastage and minimize the stress between the adhesive and the crystalline material. Other benefits of the quick-curing adhesives include improved slicing yields, increased saw blade life, removal of saw marks and elimination of loading on the saw blades.