Advanced Micro-Fabrication Equipment will unveil a sophisticated etch tool to tackle the production challenges of leading-edge film stacks at SEMICON West. The Primo AD-RIE tool is the second-generation 300 mm ultra-high frequency advanced decoupled reactive ion etch (AD-RIE) device.
Primo AD-RIE Device
The Primo AD-RIE is suitable for important process applications of 22 nm or above. Based on the earlier Primo D-RIE system, it offers similar technical advancements that assure excellent on-wafer performance and handles the difficulties encountered in manufacturing leading-edge film stacks. It features improved chamber materials for lower defects and better yields, superior tunability techniques to ensure ultra-precise uniformity of critical dimension and an innovative RF system for process repeatability and constancy.
The Primo AD-RIE reduces cost of ownership by 20% to 40% and offers 35% to 50% of capital productivity gain. Its size is 30% smaller than other competitive products. Advanced Micro-Fabrication Equipment will deliver the first Primo AD-RIE in the third quarter of 2011 to a tier-one foundry in Asia. The utilization of the predecessor model, Primo D-RIE, will be continued for applications beyond 22 nm, and for less important uses at 22 nm and more.
The Primo AD-RIE features a unique mini-batch cluster design, which allows configuration with about three dual-station process modules for maximum output. Each module has the potential to process single- or dual-wafer. The chamber’s novel design integrates a showerhead technology and proprietary plasma confinement that allow superior performance for on-wafer. A unique ESC improves temperature control for wafers and maximizes CD uniformity.
In order to meet the growing demands, Advanced Micro-Fabrication Equipment is increasing its production capacity in China. Moreover, construction of a new final assembly and testing facility located in Zhunan, Taiwan, will be completed in 2011.