Integran Technologies has introduced an Intebond adhesion technology which facilitates the formation of metal-polymer hybrid materials with superior performance. The technology complements the company’s electrodeposited structural metallization technology, nanocrystalline Nanovate.
The Intebond technology offers a strong metal-to-polymer bond, which has been proved on thermoplastics and carbon fiber reinforced thermosets. In addition, Intebond acts as a buffer for load transfer between the polymer and its outer structure that results in the formation of metal-polymer hybrids with optimized weight. Infact, Integran already has metallizing processes for extremely stiff thermoplastics, which includes polyetherimides (PEI), polyether ether ketones (PEEK) and polyphenylene sulfides (PPS), however, Intebond is an additional option provided to overcome the difficulty of metallizing plastics.
The polymers lack functional and structural metallic features. Mostly, when the outer surface of the polymer is coated with a thin layer of Nanovate metal, it imparts metallic properties to the polymer, which includes electrical conductivity, tolerance to damage and retaining design properties even after exposure to high temperatures.
The research and development Manager of Integran, Dr. Jon McCrea stated that the company has produced adhesion processes to many basic materials, however, a few of them are challenging. He added that Nanovate metal with Intebond can be applied mostly on every matter.
The Nanovate metal with Intebond technology can be applied in consumer electronics, medical, sports goods, defense and aerospace industries.
The company provides sophisticated processes and product modeling solutions to global customers via R&D, contract manufacturing, technology licensing and material sales.