STATS ChipPAC, a major provider of semiconductor packaging test, design, assembly and distribution solutions, has reported that its cutting-edge flip chip packaging technology called fcCuBE technology featuring improved assembly processes, bond-on-lead interconnection and copper column bumps is under large-scale production for numerous customers.
STATS ChipPAC has augmented its assembly processing capabilities to handle a broad range of bump pitch from > 200 µm to < 80 µm. fcCuBE technology can scale up flip chip technology to greater input/output densities and finer bump pitches, lower flip chip packaging cost, and remove stress on the subtle ELK/ULK structures at cutting-edge silicon wafer nodes.
STATS ChipPAC’s fcCuBE technology is capable of supporting both thermo-compression bonding (TCB) process and standard mass reflow assembly process. The combination of mass reflow and fcCuBE technology enables a cost reduction of 10% to 30% in package design when compared to traditional flip chip interconnect. The company has used mass reflow for the qualification of fcCuBE down to 80 µm bump pitch and is developing much finer pitches.
TCB is an intricate interconnect process than mass reflow, thus delivering the precision level necessary for bonding tighter pitch and higher density flip chip configurations. For fine pitch bump prerequisites, TCB supports chip-to-chip or chip-to-substrate bonding requirements and facilitates extremely small bump diameter assembly in highly sophisticated wafer fab nodes. Thus fcCuBE technology provides customers with the option to choose either the TCB assembly process or mass reflow and enables an improved package design for a broad spectrum of bump pitches, especially with a co-design relationship.