Applied Materials to Collaborate with TSMC on Next Generation Copper Chips

Applied Materials and Taiwan Semiconductor Manufacturing Company (TMSC) have entered into a joint development agreement.

Under the agreement TSMC will develop the next generation of copper chips using Applied Materials’ new SlimCell ™ Electrochemical Plating (ECP) system, a technology has been shown to reduce defects.

SlimCell ECP differs from other systems in that it uses a small chemical bath design that is claimed to increase its technical capability, repeatability and production worthiness. It features a small volume-plating cell linked to a chemical tank, which is replaced after a set number of wafers have been processed. The design increases repeatability and reduces costs.

For more information on semiconductors, click here.

Tell Us What You Think

Do you have a review, update or anything you would like to add to this news story?

Leave your feedback
Your comment type
Submit

While we only use edited and approved content for Azthena answers, it may on occasions provide incorrect responses. Please confirm any data provided with the related suppliers or authors. We do not provide medical advice, if you search for medical information you must always consult a medical professional before acting on any information provided.

Your questions, but not your email details will be shared with OpenAI and retained for 30 days in accordance with their privacy principles.

Please do not ask questions that use sensitive or confidential information.

Read the full Terms & Conditions.