The crucial step in obtaining good cross-sections is to scribe and cleave cleanly. The LatticeGear Cleaving Kit offers a complete set of tools to both scribe and cleave neatly and is suitable for different substrates and wafers such as Si, GaAs, and glass.
Specifications
- Diamond Scribe-pen style
- Diamond Scribe-straight tip
- Diamond Scribe-30° tip
- Tweezers with black soft fiber fine tip (length 6 ¼”)
- CleanBreak Pliers-wafer cleaving pliers
- Large 18” x 12” cutting mat-self healing, wafer cutting mat
- Small ruler mat-self healing, small wafer piece ruler mat
- Clear plastic ruler with metric and US units
- Tungsten cleaving wire
- Price: US$320