The new EVG®120 universal and completely automated resist processing tool has the ability to process several substrate shapes and sizes ranging up to 200 mm/8″.
This latest generation of the EVG120 is available in a new ultra-compact design with a nwewly developed chemistry cabinet for external storage of chemicals while offering increased throughput capability, maximized for high-volume customer requirements and ready for usage in high-volume manufacturing (HVM).
The EVG®120 offers users an intricate set of benefits that is just not found in any other tool and ensures the greatest quality standards in several fields of application at an unusually low cost of ownership.
Features
- Wafer sizes range up to 200 mm
- Ultra-compact design provided for least footprint
- Adaptable combinations of multi-functional modules for spin and spray coating, developing, bake and chill offer huge opportunities in several fields of application
- Up to two coat or develop chambers and 10 hot or chill plates available
- Chemistry cabinet available for external storage of chemicals
- CoverSpin™ rotating cover provided for low resist consumption and improved resist coating uniformity
- EV Group’s proprietary OmniSpray® ultrasonic atomization technology offers matchless results as far as conformal coating of extreme topographies is concerned
- Megasonic technology available for cleaning, sono-chemical processing, and developing enhances process efficiency and decreases the processing time from hours to minutes
- Process technology excellence and development service provided
- Advanced and field-proven robot handling with dual end-effector capability guarantees constant high throughput
- Multi-user concept (different user interface languages, assignable access rights, and limitless number of user accounts and recipes)
- Smart process control and data analysis feature (Framework SW Platform)
- Combined analysis features for process and machine control
- Parallel or queueing task processing feature
- Fitted and process performance tracking feature available
- Comes with smart handling features
- Smart maintenance management and tracking is possible
- Occurrence and alarm analysis available
Technical Data
| . |
. |
| Available modules |
Spin coat / OmniSpray® / develop
Bake / chill |
| Wafer handling options |
Single / double EE / edge handling / wafer flipping
Bowed / warped / thin wafer handling |
Smart process control &
data analysis features
(framework SW platform) |
Integrated analysis features for process and machine control
Parallel task / queueing task processing feature
Equipment and process performance tracking feature
Smart handling features
Occurrences & alarms analysis / smart maintenance management & tracking |
Wafer diameter
(substrate size) |
Up to 200 mm |
| Number of modules |
Process modules: 2
Bake / chill modules: up to 10 |
Industrial automation
features |
Ergo load cassette stations / SMIF loadports / SECS/GEM / FOUP load ports |
| Dispense options |
Various resist dispense pumps to cover a wide range of viscosities up to 52000 cP
Liquid priming / pre-wet / bowl wash
Edge bead removal (EBR) / back-side rinse (BSR)
Constant pressure dispense systems / syringe dispense system |
Resist dispense pump
features flow monitoring |
Programmable dispense rate / programmable volume / programmable suck-back
Ultrasonic |
Additional module
options |
Pre-alignment: optical / mechanical
ID-reader: barcode, alpha-numeric, data matrix |
| System control |
Operations system: Windows
File sharing & back-up solution / unlimited no. recipes & parameters / offline recipe editor
Flexible process flow definition / easy drag and drop recipe programming
Parallel processing of multiple jobs / real-time remote access, diagnostics & troubleshooting
Multi-language user GUI & support: CN, DE, FR, IT, JP, KR |
Source: EV Group