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Next Generation Detonators to be More Reliable Thanks to Porous Copper Structures

Next Generation Detonators to be More Reliable Thanks to Porous Copper Structures

Carbon Electronics Pave the Way for Faster Electronic Devices

Magnetic Shape Memory Foams, A New Class of Materials

Optimized and Improved Integrated Circuits

Next Generation Electronics to Benefit from Zero Thermal Expansion Semiconductors

New Mechanism Suggested for Superconductivity

Gecko Inspired Adhesives May be the Next Sticky Invention

Verasun Begin Work on Corn Oil Extraction Facility

Arburg to Demonstrate Allrounder 570A at Plastec West

EPA Offers Critical Examption for Methyl Bromide in 2008

Evraz Steel Bid to Acquire Claymont Steel

Fizeau Interferometers Analyze Surface with Different Reflectivities

Successful Start Up of Polypropylene Film Production for ExxonMobil

Plastic Pipe Opportunities in the Middle East

Looking at Polymerization from the Molecular Scale

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