Further easing the development of processing-intensive applications, Texas Instruments (TI) is unveiling a new system-on-chip (SoC), the 66AK2H14, and evaluation module (EVM) for its KeyStoneTM-based 66AK2Hx family of SoCs. With the new 66AK2H14 device, developers designing high-performance compute systems now have access to a 10Gbps Ethernet switch-on-chip.
Tektronix, Inc., a leading worldwide provider of test, measurement and monitoring instrumentation, today announced that its AWG70000 Arbitrary Waveform Generator Series and its PA4000 Power Analyzer won EDN China's 2013 Innovation Award in the "Communication Test" and "General Test" categories of Test and Measurement.
XENON Corporation, the world leader in pulsed light technology, announced it will feature live demonstrations of the world’s first large scale R2R pulsed light sintering system at this year’s Printed Electron...
Semiconductors, the foundation of modern electronics used in flat-screen TVs and fighter jets, could become even more versatile as researchers make headway on a novel, inexpensive way to turn them into thin films. Their report on a new liquid that can quickly dissolve nine types of key semiconductors appears in the Journal of the American Chemical Society.
Today electronics 3D printer The EX¹ launches on crowd-funding site Kickstarter. Starting from $1,199 on an early bird special, The EX¹ is a rapid prototyper that makes printing electronics and circuit boards as quick and as easy as printing a photo.
The Consumer Electronics Association (CEA)® recently announced the winners of the sixth annual Technology & Standards Awards. Nominees were judged on their commitment to excellence as evidenced by the extent and consistency of their overall, ongoing contributions to CEA’s Technology & Standards program.
Next week the IDTechEx Printed Electronics USA 2013 event will open in Santa Clara, CA, to more than 160 exhibitors and over 1,800 pre-registered attendees. The event, which is over 20% bigger than last year at this poin...
High reliability strip connectors using ruggedized insulators and military quality Flex Pin® technology are focused on providing the best and strongest strip-style interconnections in the world. These units have proven both signal integrity and reliability in many of the most demanding instruments, including mission critical portable electronics for armed forces' systems.
PRO DESIGN, veteran in the EMS and EDA industry, today announced the launch of its proFPGA duo V7 Prototyping System, a high performance, modular, flexible and cost efficient solution, which fulfils highest demands in the area of ASIC & SoC Prototyping.
Optomec announced today availability of a new entry-level offering in its lineup of systems for printed electronics, the Aerosol Jet 200 benchtop. This new system is built using Optomec’s patented Aerosol Jet core technology, but in a benchtop form factor ideally suited for research applications, such as prototyping small electronic devices, or developing and certifying new printable inks.
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