Cadence Design Systems, Inc., a leader in global electronic design innovation, today announced that MStar Semiconductor, Inc., a leading semiconductor company for display and digital home solutions, has licensed the Tensilica® Xtensa® DPU (dataplane processor unit) for a new SOC (system on chip) design for the home entertainment and home networking market segments.
Indium Corporation will feature its new SACM™ Soldering Alloy at Nepcon South China August 27-29 in Shenzhen, China.
ICCNexergy, Inc., a global leader in the design and manufacture of rechargeable power systems announced it has achieved qualification for the UL2054 Witness Test Data Program allowing ICCNexergy to conduct UL testing in its wholly-owned, state-of-the-art Design Center located in Guangzhou, China.
Axcelis Technologies, Inc., a leading supplier of enabling ion implantation solutions for the semiconductor industry, announced that it has received a follow-on order for the Optima HDx high current implanter from one of the world's leading chipmakers located in the Asia Pacific region. The Optima HDx will be used in high volume manufacturing of leading edge memory products and next generation device development. The system is scheduled to ship in the third quarter.
Adam Munich, who is entering his second year as a student at Rochester Institute of Technology, has won the Engibous Prize at the Texas Instruments Analog Design Contest and Summit in Dallas.
Epson Electronics America (EEA) has begun volume production and shipping of the SG-8003CG, a new programmable crystal oscillator in its popular SG-8003 series. The easy-to-program SG-8003CG is housed in a tiny package that measures 2.5 mm x 2.0 mm x 0.8t (max.) mm.
Ideal for use in machine manufacturing industries such as semi-conductor manufacture, Advantech’s Industrial Automation Group has launched an exciting new range of Web operator panels. These newly designed models, withflat panel IP66 certified aluminum edging, include the latest Intel Cortex-A8 processor which is not only faster but also consumes the minimum amount of power and also support for CANopen, Modbus and Ethernet protocols to ensure that they’ll connect to your existing network.
Leading semiconductor test equipment supplier Advantest Corporation has entered the market for testing advanced PCI Express (PCIe) 3.0 NVMe solid-state drives (SSDs) for enterprise and consumer applications with the versatile NEO-SSD platform, on which the company is building a family of test solutions that are scheduled to begin shipping to customers in the fourth quarter of this calendar year.
Together with its partners STFC and Fraunhofer IIS, imec announced today that the European Commission has pledged to continue funding the Europractice IC services for another 3 years under the FP7 program.
Samsung Electronics Co., Ltd., a world leader in advanced semiconductor solutions, today introduced the latest addition to the Exynos product family with top level of graphic performance driven by a six-core ARM® Mali™-T628 GPU processor for the first time in the industry.
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