Momentive Performance Materials Inc. (MPM) yesterday opened its expanded technology center in Seoul, South Korea, creating a global innovation center focused on the electronics industry. The expanded innovation center combines existing technical labs with application development, research and development (R&D), testing and manufacturing operations.
Dongbu HiTek today announced the opening of sales/marketing offices in Shanghai and Beijing with plans to open another soon in Shenzhen. The company’s bold move signals how important the rapidly growing Chinese fabless market is to its foundry business.
Pulse Electronics Corporation, a leading provider of electronic components, today announced it has implemented significant changes to its manufacturing strategy resulting in a reduction in product lead-time to 4-5 weeks. This represents a 50% reduction over typical industry lead-times of 8-10 weeks. A majority of Pulse’s products are included in the program.
In a move that would make the Alchemists of King Arthur’s time green with envy, scientists have unraveled the formula for turning liquid cement into liquid metal. This makes cement a semi-conductor and opens up its use in the profitable consumer electronics marketplace for thin films, protective coatings, and computer chips.
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Dow Corning, a global leader in silicones, silicon-based technology and innovation, today announced that it will have a major presence at IEEE Electronic Components and Technology Conference 2013 (ECTC), where it will pr...
Audio Precision, the recognized standard in audio test, today announced the availability of new Rub & Buzz and Air Leak detection acoustic tests for electro-acoustic devices using the APx series of audio analyzers.
The OE-A is debuting the new, fifth edition of the “OE-A Roadmap for Organic and Printed Electronics” as well as numerous new demonstrators at LOPE-C in Munich, Germany from June 11 to 13, 2013. The OE-A Roadmap illustrates the status and trends of applications and technologies. The new OE-A brochure also boasts an interactive cover page that includes integrated lights.
H.B. Fuller Company, a leading global adhesives provider with over 125 years of expertise and cutting-edge technologies, announced that the company is entering the growing electronics and assembly materials market with a total solutions "eco-system" approach that includes materials, processes and equipment support from the concept phase to the consumer's hands.
AMD today announced the winners of its 2013 AMD Supplier Excellence Award honored at the company's 2013 Supplier Day event in Austin. The companies recognized exhibited a strong depth of knowledge of AMD's business as well as a demonstrated ability to perform at the highest level based on the specific needs of the company.
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