Oct 8 2013
Reportlinker.com announces that a new market research report is available in its catalogue: Global Thin Layer Deposition Equipment Industry
http://www.reportlinker.com/p098256/Global-Thin-Layer-Deposition-Equipment-Industry.html#utm_source=prnewswire&utm_medium=pr&utm_campaign=Paint_and_Coating
This report analyzes the worldwide markets for Thin Layer Deposition Equipment in US$ Million. Analytics provided in the report are for equipment incorporating two major deposition techniques - Physical Vapor Deposition (PVD), and Chemical Vapor Deposition (CVD). Market analysis is also provided for each of these equipment types by their respective end-use sectors - Physical Vapor Deposition (PVD) Equipment (Microelectronics, Cutting Tools, Industrial, Specialty Packaging, Storage, Optics, & Medical), and Chemical Vapor Deposition (CVD) Equipment (Microelectronics, Cutting Tools, Industrial, and Medical).
The report provides separate comprehensive analytics for the US, Canada, Japan, Europe, Asia-Pacific, Latin America, and Rest of World. Annual estimates and forecasts are provided for the period 2010 through 2018. Also, a six-year historic analysis is provided for these markets.
The report profiles 137 companies including many key and niche players such as AIXTRON SE, Applied Materials, Inc., ASM International N.V., Canon ANELVA Corporation, CHA Industries, Inc., CVD Equipment Corporation, Denton Vacuum, LLC, Edwards Limited, Ionbond AG, Jusung Engineering Co., Ltd., KDF Electronic & Vacuum Services, Inc., Kokusai Semiconductor Equipment Corporation, Lam Research Corporation, RIBER SA, Seki Diamond Systems, Silicon Genesis Corporation, SPTS Technologies, Ti-Coating, Inc., Tokyo Electron Limited, Taiyo Nippon Sanso Corporation, ULVAC Technologies, Inc., Vapor Technologies, Inc., and Veeco Instruments, Inc.
Market data and analytics are derived from primary and secondary research.
Company profiles are primarily based on public domain information including company URLs.