Kulicke & Soffa Adds New Capillaries to Advanced Copper Solution Series

Kulicke and Soffa Industries, Inc. ("Kulicke & Soffa", "K&S" or the "Company") today announced the expansion of its Advanced Copper Solution (ACS) Series Capillaries, with the addition of ACS Max^TM and ACS Lite^TM.

The ACS Series of capillaries are based on the Company’s advanced material development and deep-rooted application knowledge. This family of capillaries offers production benefits for various copper wire bonding applications and has been expanded to serve the broader copper market:

• The ACS Pro^TM, first launched at SEMICON Taiwan in Sept of 2013, is the best fit for ultra-fine pitch and advanced copper wire bonding applications with a bond pad pitch range of 40-69 microns.
• The new ACS Max^TM is targeted for advanced package carrier families, such as mid-pin count QFP, QFN, PPF, uPPF and leadframes with a bond pad pitch range of 70-120 microns.
• The new ACS Lite^TM is targeted for low-pin count applications, such as discrete & powered integrated circuit applications using large wire diameters and a bond pad pitch in excess of 120 microns.

Nelson Wong, Kulicke & Soffa's Vice President, Wire Bond Solutions Business Unit, remarked, "Aligned with our leading position in copper wire bonding, the introduction of ACS Max^TM and ACS Lite^TM further enhances our customer’s ability to create high quality bonds using larger diameter copper wire. The unique design dynamics of the ACS Series drive cost of ownership benefits by enabling a wider process window and more consistent bond quality throughout the capillary’s life.”

The ACS Max^TM and ACS Lite^TM Capillaries will debut at the SEMICON China show at the Shanghai New International Expo Centre, Booth #3417, from March 18-20, 2014.