Oct 9 2015
IMAPS 2015 is two weeks away! The tradeshow will take place at Rosen Centre Hotel in Orlando, FL October 27th to 29th. YINCAE hopes you will stop by our Booth 409 to learn more about YINCAE and the innovative products we have to offer.
Dr. Yin will be presenting his white paper, “The Future of Solder Joint Encapsulant Adhesives.” The presentation will be Thursday, Oct 29th from 9-9:25am. This paper will focus on the use of solder joint encapsulant adhesives and their future relative to improving solder joint strength (5-10X), reducing costs, and shortening the manufacturing process by eliminating the need for Underfill.
YINCAE Advanced Materials, LLC hopes that you will come join us at the conference to learn about YINCAE and the products that we have to offer. YINCAE has exclusive products that no other company has developed. YINCAE hopes to see you there at the conference. Please visit us at booth 409!
For more information about YINCAE Advanced Materials, LLC, please visit the YINCAE Website.
About YINCAE
Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices.
YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.