Aug 16 2001
Advantages
Inherently flame retardant. High service temperature of 240°C/ 460°F. Tolerant of high humidity. Stable electrical performance over wide temperature range (-50 °C/-60 °F) to (500 °C/930 °F). Good adhesion to metal. Retains strength at elevated temperatures >200 °C/390 °F better than Epoxy or DAIP.
Disadvantages
Expensive. Low strength compared to Phenolic, Epoxy and DAIP at 20 °C (70 °F).
Applications
Encapsulation of electronic components. Glass laminates for high performance PCB. Coatings for abrasion and weather resistance particularly for Polycarbonate.
Typical Properties
Property |
Value |
Density (g/cm3)5 |
1.5 |
Surface Hardness |
RM80 |
Tensile Strength (MPa) |
28 |
Flexural Modulus (GPa) |
3.5 |
Notched Izod (kJ/m) |
0.02 |
Linear Expansion (/°C x 10-5) |
6 |
Elongation at Break (%) |
2 |
Strain at Yield (%) |
N/A |
Max. Operating Temp. (°C) |
240 |
Water Absorption (%) |
0.1 |
Oxygen Index (%) |
40 |
Flammability UL94 |
V0 |
Volume Resistivity (log ohm.cm) |
15 |
Dielectric Strength (MV/m) |
15.8 |
Dissipation Factor1 kHz |
0.002 |
Dielectric Constant 1 kHz |
2.9 |
HDT @ 0.45 MPa (°C) |
260+ |
HDT @ 1.80 MPa (°C) |
300 |
Material Drying hrs @ °C |
NA |
Melting Temp. Range (°C) |
60 - 80 |
Mould Shrinkage (%) |
2 |
Mould Temp. Range (°C) |
180 - 200 |
Source : Abstracted from Plascams
For more information on Plascams please visit The Rubber and Plastics Research Association