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Nanoscale Device Can be Used for Force Detection, Optical Communication and More

Physicists at the California Institute of Technology (Caltech) have developed a nanoscale device that can be used for force detection, optical communication, and more.

4 Jun 2009

Geckos Provide Insights into Friction and Adhesion

In a new research paper published in the Royal Society journal Interface, biology professor Kellar Autumn from Lewis + Clark College shows how the nano-hairs on gecko toes can reveal new insights into the fundamental nature of friction and adhesion.

4 Jun 2009

Solid State Dye Lasers Made Commercially Viable with Nanoparticles

"Light scattering" and "optical performance" are two concepts that usually head in opposite directions, but they have recently been shown to walk happily hand-in-hand. The results are impressive laser output from some new composite materials and the potential for making commercially viable solid-state dye lasers.

From John Wiley and Sons - Scientific Publishers 4 Jun 2009

New Memory Smashes Tradition Combining Density and Durability

Researchers with the U.S. Department of Energy's Lawrence Berkeley National Laboratory (Berkeley Lab) and the University of California (UC) Berkeley have smashed the tradition of durability and density being mutually exclusive in data storage with a new memory storage medium that can pack thousands of times more data into one square inch of space than conventional chips and retain this data for more than a billion years!

4 Jun 2009

New Processing System Reduces Defect Density in Semiconductors

Novellus Systems, a leading provider of advanced process equipment for the global semiconductor industry, has developed a sub-45nm, in-situ chamber clean process on the SPEED Max High Density Plasma (HDP) CVD gapfill platform that significantly reduces defect density and out-of-control (OOC) particle events.

4 Jun 2009

Nanoparticle Could Prevent Cardiovascular Disease

Scientists and engineers at UC Santa Barbara and other researchers have developed a nanoparticle that can attack plaque - a major cause of cardiovascular disease.

4 Jun 2009

Graphene Replaces Copper in Integrated Circuit Interconnects

The unique properties of thin layers of graphite-known as graphene-make the material attractive for a wide range of potential electronic devices. Researchers have now experimentally demonstrated the potential for another graphene application: replacing copper for interconnects in future generations of integrated circuits.

4 Jun 2009

Molecular Nanomotor Converts Sunlight Directly into Motion

Sunflowers track the sun as it moves from east to west. But people usually have to convert sunlight into electricity or heat to put its power to use. Now, a team of University of Florida chemists is the latest to repo...

4 Jun 2009

World's First Thin Film Solar Module Factory that Operates NF3-Free

Delivering a major step forward in sustainable solar power, Malibu today launched the world's first thin-film solar module factory that completely eliminates the use of nitrogen trifluoride (NF3), a greenhouse gas wi...

4 Jun 2009

EPCOS Select Automated Wafer Bonder from EV Group

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that EPCOS - a leading electronic components, modules and systems manu...

4 Jun 2009

Polycrystalline Materials Mapped at the Nanoscale

Carnegie Mellon University's Katayun Barmak, with the help of Microscopy Lab Supervisor Thomas Nuhfer, is one of the first materials scientists worldwide to successfully map polycrystalline structures on a nanoscale.

4 Jun 2009

SVTC Partners for Smallest Smallest Silicon-Based Thin-Film Transistors Ever Made

SVTC Technologies, a leading independent company providing technology development and commercialization services to global clients, has partnered with startup Schiltron Corporation to produce the smallest silicon-based t...

4 Jun 2009

Cognis Adopts Principles of Green Chemistry and Green Engineering

As part of its ongoing commitment to sustainability and innovation, global specialty chemicals supplier Cognis has adopted a new set of guidelines that combine the internationally recognized 24 principles of Green Chemis...

4 Jun 2009

Quick, Accurate and Economical Way to Prevent Flaws The Wafer Bonding Process

Pressurex® film from Sensor Products Inc. is a quick, accurate and economical way to detect and correct pressure variations which can result in flaws (defects) in the wafer bonding process. When placed between contacting surfaces, it instantaneously and permanently changes color directly proportional to the actual pressure applied.

4 Jun 2009

BASF to Supply Largest Ever Amount of Alumino-Silicate Gel to World's Largest Gas Dehydration and Hydrocarbon Removal Plant

BASF's Catalysts division will provide a total of 2,000 tons of its Sorbead H and WS for the world's largest gas dehydration and hydrocarbon removal plant based on adsorption technology, located at the Portovaya ...

From BASF Corporation 4 Jun 2009