Seagate Technology plc today announced that its Samsung® HDD division is shipping the new 2.5-inch Spinpoint™ M9T, which at 9.5 mm thin is the world's thinnest 2TB hard drive. Offered in capacities of 1.5TB and 2TB, the Spinpoint M9T mobile drive gives OEMs, channel system integrators and consumers a thin, high-capacity storage solution ideal for external storage, notebook integration and upgrades, desktop, and gaming system applications.
Researchers from Georgia Tech, the University of Tokyo and Microsoft Research have developed a novel method to rapidly and cheaply make electrical circuits by printing them with commodity inkjet printers and off-the-shelf materials. For about $300 in equipment costs, anyone can produce working electrical circuits in the 60 seconds it takes to print them.
Nordson ASYMTEK, a Nordson company (NASDAQ: NDSN), a leader in dispensing and jetting technologies, will introduce the Spectrum™ II at Productronica this year, marking the 6-year anniversary of the introduction of the Spectrum series of high-speed, high-accuracy dispensing platforms for a wide variety of precision dispensing applications in microelectronics and semiconductor manufacturing and MEMS and LED assembly.
Power management company Eaton today announced the launch of AEGIS™ Series surge and line protection solutions. The series combines superior surge protection and filtering capacitors designed to help original equipment manufacturers (OEMs) reduce downtime and maintenance costs.
Current chip technology used for purchasing items via credit and debit cards in shops was developed in the mid-1990s. EMVCo, the standard body which manages, maintains and advances EMV Specifications, is in the process of designing the next generation payment technology to meet long-term industry requirements.
Imec, a leading nanoelectronics research center, announced today that it has successfully demonstrated the first III-V compound semiconductor FinFET devices integrated epitaxially on 300mm silicon wafers, through a unique silicon fin replacement process.
NANIUM S.A., Europe’s largest outsourced semiconductor assembly and test (OSAT) service provider, today announced the introduction of an improved dielectric material and process solution for its fan-out wafer-level packaging (FOWLP) technology, embedded wafer-level ball grid array (eWLB). These improvements increase eWLB’s reliability, thereby extending the existing technology platform into more demanding markets and applications including medical devices, aerospace and automotive, among others.
Materion Microelectronics & Services, a Materion Corporation business, was presented with the "Partner of the Year Award" by International Rectifier (IR®), a world leader in power management technology. The award recognized Materion's achievements in the category of fab materials as a supplier of high-quality, cost-effective wafer fabrication materials to IR locations in Temecula, California, Newport, Wales and Singapore.
Indium Corporation will feature its new technology platform using the SACM™ Solder Alloy at Productronica November 12-15 in Münich, Germany.
Viasystems Group, Inc., a leading provider of complex multilayer printed circuit boards (PCBs) and electro-mechanical solutions today announced the opening of its new North American PCB Technology and Manufacturing Center in Anaheim, California.
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